Artwork

Innehåll tillhandahållet av Francoise von Trapp. Allt poddinnehåll inklusive avsnitt, grafik och podcastbeskrivningar laddas upp och tillhandahålls direkt av Francoise von Trapp eller deras podcastplattformspartner. Om du tror att någon använder ditt upphovsrättsskyddade verk utan din tillåtelse kan du följa processen som beskrivs här https://sv.player.fm/legal.
Player FM - Podcast-app
Gå offline med appen Player FM !

Lam Research’s Chee Ping Lee Explains the Role of HBM in Generative AI

39:11
 
Dela
 

Manage episode 443343871 series 2935206
Innehåll tillhandahållet av Francoise von Trapp. Allt poddinnehåll inklusive avsnitt, grafik och podcastbeskrivningar laddas upp och tillhandahålls direkt av Francoise von Trapp eller deras podcastplattformspartner. Om du tror att någon använder ditt upphovsrättsskyddade verk utan din tillåtelse kan du följa processen som beskrivs här https://sv.player.fm/legal.

Send us a text

In this episode, Françoise von Trapp speaks with Chee Ping Lee, of Lam Research, about the critical role of high bandwidth memory (HBM) in generative AI, emphasizing its high bandwidth and compact design.
HBM memory has received a lot of attention as one of the first technologies to implement 2.5D and 3D stacking. Lee explains how HBM uses advanced packaging technologies like TSV and microbumps to achieve high memory capacity and performance. Lam Research's solutions are key to HBM's success.

Listen to learn details about:

  • The importance of HBM for AI chip manufacturing
  • The relationship between advancedpackaging and HBM
  • The differences between different HBM generations
  • The future of microbumps and hybrid bonding
  • Lam Research’s advanced packaging solutions

Contact Chee Ping Lee on LinkedIN

Learn more about why HBM Is a critical enabler for generative AI in this blog post.

Lam Research
Lam Research equipment and services allow chipmakers to build smaller and better performing devices
Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.
Support the show

Become a sustaining member!
Like what you hear? Follow us on LinkedIn and Twitter
Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.
Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

  continue reading

146 episoder

Artwork
iconDela
 
Manage episode 443343871 series 2935206
Innehåll tillhandahållet av Francoise von Trapp. Allt poddinnehåll inklusive avsnitt, grafik och podcastbeskrivningar laddas upp och tillhandahålls direkt av Francoise von Trapp eller deras podcastplattformspartner. Om du tror att någon använder ditt upphovsrättsskyddade verk utan din tillåtelse kan du följa processen som beskrivs här https://sv.player.fm/legal.

Send us a text

In this episode, Françoise von Trapp speaks with Chee Ping Lee, of Lam Research, about the critical role of high bandwidth memory (HBM) in generative AI, emphasizing its high bandwidth and compact design.
HBM memory has received a lot of attention as one of the first technologies to implement 2.5D and 3D stacking. Lee explains how HBM uses advanced packaging technologies like TSV and microbumps to achieve high memory capacity and performance. Lam Research's solutions are key to HBM's success.

Listen to learn details about:

  • The importance of HBM for AI chip manufacturing
  • The relationship between advancedpackaging and HBM
  • The differences between different HBM generations
  • The future of microbumps and hybrid bonding
  • Lam Research’s advanced packaging solutions

Contact Chee Ping Lee on LinkedIN

Learn more about why HBM Is a critical enabler for generative AI in this blog post.

Lam Research
Lam Research equipment and services allow chipmakers to build smaller and better performing devices
Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.
Support the show

Become a sustaining member!
Like what you hear? Follow us on LinkedIn and Twitter
Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.
Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

  continue reading

146 episoder

Todos los episodios

×
 
Loading …

Välkommen till Player FM

Player FM scannar webben för högkvalitativa podcasts för dig att njuta av nu direkt. Den är den bästa podcast-appen och den fungerar med Android, Iphone och webben. Bli medlem för att synka prenumerationer mellan enheter.

 

Snabbguide